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B Engineering |
Embrittlement relief Adhesion Elongation Tensile strength |
Wear resistance Abrasion resistance |
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B Engineering |
Embrittlement relief Hardness Porosity |
Wear resistance Abrasion resistance |
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B 13um thick C 8um thick D 5um thick |
Embrittlement relief Reactivation treatment Supplementary treatment Adhesion Salt Spray |
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B Semi-bright C Bright |
Embrittlement relief Roghness Solderability Tarnish resistance Adhesion Tensile strength |
Corrosion protection Electrical conductivity |
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B .0003" thick C .0002" thick |
Embrittlement relief Supplementary treatment Adhesion Salt Spray Tensile strength |
Paint base |
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Electroplated or Hot Tin Dipped |
B Hot Tin Dipped |
Solderability Salt Spray |
Wear resistance Corrosion protection Resist case hardening |
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B .33 um Copper Substrate |
Embrittlement relief Adhesion Salt Spray |
Non-reflectivity Heat resistance |
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Embrittlement relief Salt Spray |
Non-reflectivity Heat resistance |
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B .001" thick C .0005" thick D .0002" thick E .0001" thick |
Embrittlement relief Adhesion Salt Spray |
Printed circuits |
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B Pin Point C Intermediate D Grit Blast |
Pitting Adhesion Cleanliness |
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B Adhesion |
Adhesion |
Abrasion resistance |
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B .00003" thick C .00005" thick D .0001" thick E .0002" thick F .0003" thick G .0005" thick H .0015" thick |
Embrittlement relief Hardness Adhesion Heat resistance Solderability |
Corrosion protection Soldering |
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Embrittlement relief Adhesion Tensile strength |
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Stress relief Embrittlement relief Adhesion |
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B .00001" thick C .00002" thick D .0001" thick E .00025" thick |
Embrittlement relief Adhesion Reflectivity |
Anti-galling Corrosion protection |
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Stress relief Embrittlement relief Adhesion |
Soldering Printed circuits |